Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/27/1999
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Application #:
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08776936
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Filing Dt:
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04/10/1997
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Inventors:
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ROLF ASCHENBRENNER, JORG GWIASDA, ELKE ZAKEL, JOACHIM ELDRING
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Title:
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FLIP CHIP BONDING WITH NON CONDUCTIVE ADHESIVE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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LEONRODSTRASSE 54 |
D-80636 MUNCHEN, GERMANY |
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ECKERT SEAMANS CHERIN & MELLOTT |
STEPHEN P. GRIBOK |
1700 MARKET STREET |
SUITE 3232 |
PHILADELPHIA, PA 19103 |
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