Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/03/1999
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Application #:
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08882348
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Filing Dt:
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06/25/1997
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Inventors:
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HIROSHI FURUKAWA, HIROTAKA KATO, HIROAKI YAMAMOTO, KAZUAKI FUJIMOTO
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Title:
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METHOD OF FABRICATING DIRECT-BONDED SEMICONDUCTOR WAFERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2612 SHINOMIYA HIRATSUKA-SHI |
| KANAGAWA, JAPAN |
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| VARNDELL LEGAL GROUP |
| R. EUGENE VARNDELL, JR. |
| SUITE 220, 1150 S. WASHINGTON STREET |
| ARLINGTON, VA 22314 |
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