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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/24/1999
Application #:
08920133
Filing Dt:
08/27/1997
Inventors:
LIANG-GI YAO, YEUR-LUEN TU, SEN-HUAN HUANG, KWONG-JR TSAI, MENG-JAW CHERNG
Title:
METHOD OF FABRICATING A PASSIVATION LAYER FOR INTERGRATED CIRCUITS
Assignment: 1
Reel/Frame:
008701/0579Recorded: 08/27/1997Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/07/1997
Exec Dt:
08/08/1997
Exec Dt:
08/11/1997
Exec Dt:
08/11/1997
Exec Dt:
08/12/1997
Assignee:
SCIENCE-BASED INDUSTRIAL PARK
123, PARK AVE-3RD
HSINCHU, TAIWAN R.O.C
Correspondent:
CHRISTENSEN O'CONNOR JOHNSON & KINDNESS
JAMES W. SOONG, ESQ.
1420 FIFTH AVENUE
SUITE 2800
SEATTLE, WA 98101-2347

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