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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/28/1999
Application #:
08795518
Filing Dt:
02/05/1997
Inventors:
CHUNG-HSIUNG WANG, DUEN-JEN CHENG
Title:
SUBSTRATE STRUCTURE WITH ADHESIVE ANCHORING-SEAMS FOR SECURELY ATTACHING AND BODING TO A THIN FILM SUPPORTED THEREON
Assignment: 1
Reel/Frame:
008450/0731Recorded: 02/05/1997Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/22/1997
Exec Dt:
01/22/1997
Assignee:
SCIENCE-BASED INDUSTRIAL PARK
29 INDUSTRIAL EAST ROAD
HSINCHU, R.O.C., TAIWAN
Correspondent:
BO-IN LIN
13445 MANDOLI DRIVE
LOS ALTOS HILLS, CA 94022
Assignment: 2
Reel/Frame:
020431/0271Recorded: 01/30/2008Pages: 6
Conveyance:
CHANGE OF THE NAME AND ADDRESS OF THE ASSIGNEE
Assignor:
Exec Dt:
01/30/2008
Assignee:
NO.2, RESEARCH & DEVELOPMENT 2ND RD., SCIENCE PARK
HSIN-CHU, TAIWAN
Correspondent:
WINSTON HSU
P.O.BOX 506
MERRIFIELD, VA 22116

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