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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/05/1999
Application #:
08858640
Filing Dt:
05/19/1997
Inventors:
WARREN HAYDEN, RONALD WILLIAMS
Title:
ELECTRONIC MICROPACKAGING ASSEMBLY AND ITS FABRICATION
Assignment: 1
Reel/Frame:
008921/0524Recorded: 12/05/1997Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/13/1997
Exec Dt:
11/25/1997
Assignee:
BLDG. C01, M/S A126
7200 HUGHES TERRACE
LOS ANGELES, CALIFORNIA 90045
Correspondent:
HUGHES ELECTRONICS
GORDON R. LINDEEN III
7200 HUGHES TERRACE
BLDG. C01, M/S A126
LOS ANGELES, CA 90045
Assignment: 2
Reel/Frame:
013295/0642Recorded: 09/17/2002Pages: 4
Conveyance:
CONFIRMATORY LICENSE (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
02/26/1998
Assignee:
106 WYNN DRIVE
ATTN: SMDC-LC-H
HUNTSVILLE, ALABAMA 35805
Correspondent:
USA SPACE & MISSILE DEFENSE COMMAND
CHRISTELLA M. GREEN
106 WYNN DRIVE
HUNTSVILLE, AL 35805

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