Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/02/1999
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Application #:
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08964718
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Filing Dt:
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11/05/1997
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Inventor:
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RAHUL CHATURVEDI
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Title:
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MULTILAYER CERAMIC PACKAGE WITH CENTER GROUND VIA FOR SIZE REDUCTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CORPORATE OFFICES INTELLECTUAL PROPERTY DEPARTMENT |
| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, ILLINOIS 60196 |
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| MOTOROLA, INC. |
| GARY J. CUNNINGHAM |
| CORPORATE OFFICES INTEL. PROP. DEPT. |
| 1303 E. ALGONQUIN ROAD |
| SCHAUMBURG, IL 60196 |
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