Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/09/1999
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Application #:
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08590465
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Filing Dt:
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01/23/1996
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Inventors:
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TAKAHIRO MATSUO, YOSHIO MARUYAMA, OSAMU HIKITA, SHINJI KADORIKU
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Title:
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MODULE FOR PACKAGED IC
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006, OAZA KADOMA, KADOMA-SHI |
| OSAKA-FU, JAPAN |
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| WENDEROTH, LIND & PONACK |
| MR. NILES E. PEDERSEN |
| 805 15TH STREET, N.W. |
| SUITE 700 |
| WASHINGTON, DC 20005 |
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