Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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08873742
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Filing Dt:
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06/12/1997
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Inventors:
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KATSUHIRO INOUE, NOBUO IGUSA, TAKESHI OHORI
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Title:
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METHOD OF BONDING CHIP PARTS A CHIP PART TO A SUBSTRATE USING SOLDER BUMPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NAKAHARA-KU, KAWASAKI-SHI |
| 1-1, KAMIKODANAKA 4-CHOME |
| KANAGAWA 211, JAPAN |
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| STAAS & HALSEY |
| JAMES D. HALSEY, JR. |
| 700 11TH ST., NW |
| SUITE 500 |
| WASHINGTON, DC 20001 |
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