Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/16/1999
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Application #:
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08850749
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Filing Dt:
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05/02/1997
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Inventor:
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GLENN JOSEPH LEEDY
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Title:
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HIGH DENSITY THREE-DIMENSIONAL IC INTERCONNECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8010 BETHEL CHURCH ROAD |
| SALINE, MICHIGAN 48176 |
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| BURNS, DOANE, SWECKER & MATHIS, L.L.P. |
| MICHAEL J. URE |
| P.O. BOX 1404 |
| ALEXANDRIA, VIRGINIA 22313-1404 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-77, R.O.C. |
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| DANIEL R. MCCLURE |
| 600 GALLERIA PARKWAY, S.E. |
| SUITE 1500 |
| ATLANTA, GA 30339 |
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