Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08998442
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Filing Dt:
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12/24/1997
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Inventors:
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NIKHIL KELKAR, JAIME A. BAYAN
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Title:
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APPLICATION OF WIRE BOND LOOP AS INTEGRATED CIRCUIT PACKAGE COMPONENT INTERCONNECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95052 |
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| BEYER & WEAVER, LLP |
| STEVE D. BEYER |
| P.O. BOX 51147 |
| PALO ALTO, CA 94303 |
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Assignment:
2
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CORRECTED RECORDATION FORM COVER SHEET TO CORRECT STATE OF INCORPORATION, PREVIOUSLY RECORDED AT REEL/FRAME 8942/0949 (ASSIGNMENT OF ASSIGNOR'S INTEREST)
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95052 |
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| BEYER & WEAVER, LLP |
| STEVE D BEYER |
| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CA 95052 |
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