Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/1999
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Application #:
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08649837
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Filing Dt:
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04/30/1996
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Inventors:
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KAZUAKI KARASAWA, TERU NAKANISHI, TOSHIYA AKAMATSU
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Title:
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METHOD OF FORMING SOLDER BUMPS ONTO AN INTEGRATED CIRCUIT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU KAWASAKI-SHI |
| KANAGAWA 211, JAPAN |
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| STAAS & HALSEY |
| H.J. STAAS |
| 700 ELEVENTH STREET, N.W. |
| STE. 500 |
| WASHINGTON, DC 20001 |
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