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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/01/2000
Application #:
09001349
Filing Dt:
12/31/1997
Inventors:
MAKAREM A. HUSSEIN, KEVIN J. LEE, SWAMINATHAN SIVAKUMAR
Title:
SINGLE STEP ELECTROPLATING PROCESS FOR INTERCONNECT VIA FILL AND METAL LINE PATTERNING
Assignment: 1
Reel/Frame:
009217/0880Recorded: 05/26/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/13/1998
Exec Dt:
05/13/1998
Exec Dt:
05/13/1998
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95052
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN
DINU GRUIA
12400 WILSHIRE BOULEVARD
7TH FLOOR
LOS ANGELES, CA 90025

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