Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2000
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Application #:
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08675607
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Filing Dt:
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07/03/1996
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Inventor:
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JENG-KUO JENG
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Title:
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METHOD AND APPARATUS FOR CONDUCTING FAILURE ANALYSIS ON IC CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCINECE-BASED INDUSTRIAL PARK |
| 123, PARK AVENUE, 3RD |
| HSINCHU, TAIWAN 30077 |
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| BARNES, KISSELLE, RAISCH, CHOATE, |
| WHITTERMORE & HULBERT, P.C. |
| RANDY W. TUNG |
| 3500 PENOBSCOT BUILDING/645 GRISWOLD |
| DETROIT, MICHIGAN 48226-4217 |
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