skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
6025258
Issue Dt:
02/15/2000
Application #:
08516284
Filing Dt:
08/17/1995
Inventors:
MASAYUKI OCHIAI, HIDEFUMI UEDA, MICHIO SONO, ICHIRO YAMAGUCHI, KAZUHIKO MITOBE et al
Title:
METHOD FOR FABRICATING SOLDER BUMPS BY FORMING SOLDER BALLS WITH A SOLDER BALL FORMING MEMBER
Assignment: 1
Reel/Frame:
007633/0320Recorded: 08/17/1995Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OCHIAI, MASAYUKI
Exec Dt:
07/27/1995
UEDA, HIDEFUMI
Exec Dt:
07/27/1995
SONO, MICHIO
Exec Dt:
07/27/1995
YAMAGUCHI, ICHIRO
Exec Dt:
07/27/1995
MITOBE, KAZUHIKO
Exec Dt:
07/27/1995
OTAKE, KOKI
Exec Dt:
07/27/1995
KASAI, JUNICHI
Exec Dt:
07/27/1995
KAMEHARA, NOBUO
Exec Dt:
07/27/1995
YAMAGISHI, YASUO
Exec Dt:
07/27/1995
MIZUKOSHI, MASATAKA
Exec Dt:
07/27/1995
Assignee:
FUJITSU LIMITED
1015, KAMIKODANAKA, NAKAHARA-KU
KAWASAKI-SHI, KANAGAWA 211, JAPAN
Correspondent:
ARMSTRONG, WESTERMAN, HATTORI, MCLELAND
& NAUGHTON
MEL R. QUINTOS
1725 K ST., NW - SUITE 1000
WASHINGTON, DC 20006

Search Results as of: 04/29/2024 05:18 AM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT