Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/22/2000
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Application #:
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09274832
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Filing Dt:
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03/23/1999
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Inventors:
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STEVEN S. CHAN, JOHN E. DOWSING III, JASON E. SNODGRESS
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Title:
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LOW COST HERMETIC SEALED MICROWAVE MODULE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1840 CENTURY PARK EAST |
LOS ANGELES, CALIFORNIA 90067-2199 |
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NORTHROP GRUMMAN CORPORATION |
TERRY J. ANDERSON |
1840 CENTURY PARK EAST, M/S 30/110-31 |
LOS ANGELES, CA 90067-2199 |
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