Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/22/2000
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Application #:
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09306950
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Filing Dt:
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11/04/2008
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Inventor:
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CHEN HUA YU
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Title:
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BONDS PADS EQUIPPED WITH HEAT DISSIPATING RINGS AND METHOD FOR FORMING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 121, PARK AVENUE 3 |
| HSIN-CHU, TAIWAN R.O.C |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 WEST LONG LAKE ROAD, SUITE 120 |
| BLOOMFIELD HILLS, MI 48302 |
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