Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/29/2000
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Application #:
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09098445
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Filing Dt:
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06/17/1998
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Inventors:
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INDERJIT SINGH, SESHADRI VIKRAM
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Title:
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WIRE BONDING METHODS AND APPARATUS FOR HEAT SENSITIVE METALLIZATION USING A THERMALLY INSULATED SUPPORT PORTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95052 |
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| BEYER & WEAVER, LLP |
| STEVE D. BEYER |
| P.O. BOX 61059 |
| PALO ALTO, CA 94306 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION FILED ON 6-17-98, RECORDED ON REEL 9258 FRAME 0498.
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| BEYER WEAVER & THOMAS LLP |
| STEVE D. BEYER |
| P.O. BOX 778 |
| BERKELEY, CA 94704-0778 |
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