Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/07/2000
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Application #:
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08721265
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Filing Dt:
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09/26/1996
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Inventors:
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HIDEO HORITA, CHIAKI HATSUTA
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Title:
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LEAD FRAME, METHOD FOR PARTIAL NOBLE PLATING OF SAID LEAD FRAME AND SEMICONDUCTOR DEVICE HAVING SAID LEAD FRAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, ICHIGAYA-KAGA-CHO 1-CHOME |
| SHINJUKU-KU, TOKYO-TO, JAPAN |
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| PARKHURST, WENDEL & BURR, L.L.P. |
| ROGER W. PARKHURST |
| 1421 PRINCE STREET, SUITE 210 |
| ALEXANDRIA, VIRGINIA 22314-2805 |
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