Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/14/2000
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Application #:
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08934448
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Filing Dt:
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09/19/1997
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Inventors:
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BARBARA LEHNER, RECAI SEZI
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Title:
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UV-HARDENABLE AND THERMALLY HARDENABLE EPOXY RESINS FOR UNDERFILLING ELECTRICAL AND ELECTRONIC COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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WITTLESBACHERPLATZ 2 |
80333 MUENCHEN, GERMANY |
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HILL & SIMPSON, P.C. |
JOHN D. SIMPSON |
85TH FLOOR SEARS TOWER |
233 SOUTH WACKER DRIVE |
CHICAGO, IL 60606 |
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