Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/27/2000
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Application #:
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09285971
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Filing Dt:
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04/05/1999
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Inventor:
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KEI MURAYAMA
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Title:
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SEMICONDUCTOR CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NAGANO-SHI, |
| 711, AZA SHARIDEN, OAZA KURITA, |
| NAGANO 380-0921, JAPAN |
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| PENNIE & EDMONDS LLP |
| ALLAN A. FANUCCI |
| 1155 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10O36 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1308 MOFFETT PARK DRIVE |
| SUNNYVALE, CALIFORNIA 94089 |
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| R. BURNS ISRAELSEN |
| 1000 EAGLE GATE TOWER |
| 60 EAST SOUTH TEMPLE |
| SALT LAKE CITY, UT 84111 |
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