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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
07/25/2000
Application #:
08997293
Filing Dt:
12/23/1997
Inventors:
EBRAHIM ANDIDEH, MATTHEW J. PRINCE
Title:
POLISH PAD WITH NON-UNIFORM GROOVE DEPTH TO IMPROVE WAFER POLISH RATE UNIFORMITY
Assignment: 1
Reel/Frame:
009250/0652Recorded: 06/11/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/20/1998
Exec Dt:
05/20/1998
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN
12400 WILSHIRE BLVD.
7TH FLOOR
LOS ANGELES, CA 90025
Assignment: 2
Reel/Frame:
009410/0903Recorded: 11/16/1998Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/20/1998
Exec Dt:
05/20/1998
Assignee:
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN
DARREN J. MILLIKEN
12400 WILSHIRE BLVD.
7TH FLOOR
LOS ANGELES, CA 90025

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