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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/08/2000
Application #:
09148563
Filing Dt:
09/04/1998
Inventors:
JIAW-REN SHIH, BI-LING LIN, HUEY-LIANG HWANG
Title:
PROCESSS TO IMPROVE TEMPERATURE UNIFORMITY DURING RTA BY DEPOSITION OF IN SITU POLY ON THE WAFER BACKSIDE
Assignment: 1
Reel/Frame:
009441/0660Recorded: 09/04/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/23/1998
Exec Dt:
07/23/1998
Exec Dt:
07/23/1998
Assignee:
121 PARK AVE. 3 SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN R.O.C
Correspondent:
GEORGE O. SAILE
20 MCINTOSH DRIVE
POUGHKEEPSIE, NY 12603

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