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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/22/2000
Application #:
09019396
Filing Dt:
02/05/1998
Inventors:
STEVEN A. CORDES, PETER ALFRED GRUBER, EGON MAX KUMMER, STEPHEN ROUX et al
Title:
ETCHED GLASS SOLDER BUMP TRANSFER FOR FLIP CHIP INTEGRATED CIRCUIT DEVICES
Assignment: 1
Reel/Frame:
009013/0557Recorded: 02/05/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/1998
Exec Dt:
01/28/1998
Exec Dt:
01/28/1998
Exec Dt:
02/02/1998
Exec Dt:
01/30/1998
Exec Dt:
01/28/1998
Assignee:
ARMONK, NEW YORK 10504
Correspondent:
ALVIN J. RIDDLES
BOX 34 - CANDLEWOOD ISLE
NEW FAIRFIELD, CT 06812

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