Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/10/2000
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Application #:
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09503428
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Filing Dt:
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02/14/2000
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Inventors:
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Yoshimitsu Terakado, Kazumasa Sasakura, Shigeru Shiozawa
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Title:
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Wire bonding apparatus
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-51-1, INADAIRA, MUSASHI |
MURAYAMA-SHI, TOKYO, JAPAN |
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KODA & ANDROLIA |
H. HENRY KODA |
10100 SANTA MONICA BLVD. |
SUITE 2340 |
LOS ANGELES, CA 90067 |
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