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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/10/2000
Application #:
09166185
Filing Dt:
10/05/1998
Inventor:
JAE-HEE HA
Title:
INTERCONNECTION FABRICATION METHOD FOR SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
009501/0857Recorded: 10/05/1998Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/16/1998
Assignee:
1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU
CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN, LEWIS & BOCKIUS LLP
ROBERT J. GAYBRICK
1800 M STREET, N.W.
WASHINGTON, D.C. 20036
Assignment: 2
Reel/Frame:
010951/0606Recorded: 07/11/2000Pages: 82
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/20/1999
Assignee:
SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI
KYOUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
MORGAN, LEWIS & BOCKIUS LLP
MR. SUNWOO LEE
1800 M STREET, N.W.
WASHINGTON, D.C. 20036

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