Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09048467
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Filing Dt:
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03/26/1998
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Inventors:
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JACOB JENG, KUN-LUH CHEN, EDWARD CHEN
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Title:
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ARCHITECTURE FOR DUAL-CHIP INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F, NO. 13 INNOVATION ROAD I, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN R.O.C |
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| KNOBBE, MARTENS, OLSON & BEAR, LLP |
| WILLIAM B. BUNKER |
| 620 NEWPORT CENTER DRIVE, 16TH FLOOR |
| NEWPORT BEACH, CA 92660 |
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