Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09299681
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Filing Dt:
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04/26/1999
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Inventors:
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CHARLIE HAN, MING-HUANG HUNG
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Title:
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MULTI-CHIP MODULE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO.3, LI-HSIN RD., II |
| HSINCHU,, TAIWAN |
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| HICKMAN STEPHENS & COLEMAN, LLP |
| L. KEITH STEPHENS |
| P.O. BOX 52037 |
| PALO ALTO, CA 94303-0746 |
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