Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/14/2000
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Application #:
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09195996
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Filing Dt:
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11/20/1998
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Inventor:
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JU-HWA LEE
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Title:
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A METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, HYANGJEONG-DONG, HEUNGDUK-KU, CHEONGJU-SI |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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| MORGAN, LEWIS & BOCKIUS LLP |
| MR. ROBERT J. GAYBRICK |
| 1800 M STREET, N.W. |
| WASHINGTON, D.C. 20036 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHON-SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| MORGAN, LEWIS & BOCKIUS LLP |
| MR. SUNWOO LEE |
| 1800 M STREET, N.W. |
| WASHINGTON, D.C. 20036 |
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