Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/19/2000
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Application #:
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09387954
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Filing Dt:
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09/01/1999
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Inventors:
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SOO-CHEOL LEE, JONG-HYON AHN, HYAE-RYOUNG LEE
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Title:
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INTEGRATED CIRCUIT BONDING PADS INCLUDING INTERMEDIATE CLOSED CONDUCTIVE LAYERS HAVING SPACED APART INSULATING ISLANDS THEREIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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146 MAETAN-DONG, PALDAL-GU |
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF |
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MYERS BIGEL SIBLEY & SAJOVEC |
MITCHELL S. BIGEL |
P.O. BOX 37428 |
RALEIGH, NC 27627 |
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