Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/2000
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Application #:
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09209634
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Filing Dt:
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12/10/1998
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Inventors:
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FANG-JUN LEU, RONG-SHEN LEE, HSIN-CHIEN HUANG, RANDY HSIAO-YU LO, CHIANG-HAN DAY
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Title:
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FLIP-CHIP BALL GRID ARRAY PACKAGE WITH A HEAT SLUG
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195, SEC. 4, CHUNG HSING RD. |
| CHUTUNG, HSINCHU, R.O.C., TAIWAN |
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| JASON Z. LIN |
| 19597 VIA MONTE DRIVE |
| SARATOGA, CA 95070 |
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