Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/16/2001
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Application #:
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09261997
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Filing Dt:
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03/05/1999
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Inventors:
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SAN-DE TZU, CHING-SHIUN CHIU, CHIA-HUI LIN
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Title:
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E-BEAM DIRECT WRITING TO PATTERN STEP PROFILES OF DIELECTRIC LAYERS APPLIED TO FILL POLY VIA WITH POLY LINE, CONTACT WITH METAL LINE, AND METAL VIA WITH METAL LINE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| 121 PARK AVENUE 3 |
| HSIN-CHU, TAIWAN |
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| GEORGE O. SAILE |
| 20 MCINTOSH DRIVE |
| POUGHKEEPSIE, NY 12603 |
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