Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/30/2001
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Application #:
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09243031
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Filing Dt:
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02/03/1999
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Inventors:
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LING-CHEN KUNG, HSU-TIEN HU, RUOH-HUEY UANG, SZU-WEI LU, CHUN-YI KUO
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Title:
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METHOD FOR FORMING SOLDER BUMPS OF IMPROVED HEIGHT AND DEVICES FORMED
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 195 SEC. 4 CHUNG HSING ROAD |
| CHUTUNG, HSINCHU, TAIWAN 310, |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MICHIGAN 48302 |
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