Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2001
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Application #:
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09394263
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Filing Dt:
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09/10/1999
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Inventor:
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SHIH-HAO LIN
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Title:
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BALL GRID ARRAY PACKAGE WITH CONDUCTIVE LEADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, TA-FONG RD., TAN-TZU HSIANG |
TAICHUNG HSIEN, TAIWAN |
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J.C. PATENTS, INC. |
JIAWEI HUANG |
1340 REYNOLDS AVE. |
SUITE 114 |
IRVINE, CA 92614 |
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