Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/13/2001
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Application #:
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09379599
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Filing Dt:
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08/24/1999
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Inventors:
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PO-YAO LIN, CHING-BAI HWANG
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Title:
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INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE HEAT DISSIPATION PATHS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD. |
| CHUTUNG, HSINCHU, TAIWAN R.O.C |
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| POLLOCK, VANDE SANDE & AMERNICK |
| BURTON A. AMERNICK |
| 1990 M STREET, N.W., SUITE 800 |
| WASHINGTON, D.C. 20036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 23, XINGHUA RD. |
| TAOYUAN CITY, TAOYUAN COUNTY, TAIWAN 330 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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