Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2001
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Application #:
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09378988
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Filing Dt:
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08/23/1999
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Inventors:
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GARY F. GOTH, JOHN J. LOPARCO, PRABJIT SINGH
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Title:
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SEALED MULTI-CHIP MODULE COOLING SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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CANTOR COLBURN LLP |
PHILMORE H. COLBURN |
88 DAY HILL ROAD |
WINDSOR, CT 06095 |
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