Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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09047901
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Filing Dt:
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03/25/1998
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Inventors:
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JACOB JENG, KUN-LUH CHEN, EDWARD CHEN
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Title:
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INTEGRATED CIRCUIT PACKAGE ARCHITECTURE WITH A VARIABLE DISPENSED COMPOUND AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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A CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTIVE DATES ON REEL 9072 FRAME 0828
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 13, INNOVATION RD |
| HSINCHU, TAIWAN R.O.C |
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| CHRISTIE, PARKER & HALE, LLP |
| VINCENT G. GIOIA |
| P.O. BOX 7068 |
| PASADENA, CA 91109-7068 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 13, INNOVATION RD. |
| HSINCHU, TAIWAN R.O.C |
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| CHRISTIE, PARKER & HALE, LLP |
| ATTN: VINCENT G. GIOIA |
| P.O. BOX 7068 |
| PASADENA, CA 91109-7068 |
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