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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/10/2001
Application #:
09185561
Filing Dt:
11/04/1998
Inventors:
WILLIAM T. CHEN, SYAMAL KUMAR LAHIRI
Title:
AREA ARRAY STUD BUMP FLIP CHIP DEVICE AND ASSEMBLY PROCESS
Assignment: 1
Reel/Frame:
009582/0724Recorded: 11/04/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/11/1998
Exec Dt:
10/13/1998
Assignee:
NATIONAL UNIVERSITY OF SINGAPORE
SINGAPORE 11926
Correspondent:
LAWRENCE N. GINSBERG
907 CITRUS PLACE
NEWPORT BEACH, CA 92660-3227

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