Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/10/2001
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Application #:
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09270808
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Filing Dt:
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03/17/1999
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Inventors:
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TSUNG-CHIEH CHEN, KEN-HSIUNG HSU, YI-LIANG PENG, CHENG-CHIEH HSU
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Title:
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DUAL-SIDED HEAT DISSIPATING STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6F, NO. 201-24, TUN HWA N. ROAD |
| TAIPEI, R.O.C., TAIWAN |
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| DOUGHERTY & TROXELL |
| BRUCE H. TROXELL, ESQ. |
| 5203 LEESBURG PIKE, SUITE 600 |
| FALLS CHURCH, VIRGINIA 22041-3401 |
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