Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/01/2001
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Application #:
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09501966
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Filing Dt:
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02/10/2000
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Inventors:
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Paul Kwok Keung Ho, Mei Sheng Zhou, Subhash Gupta, Chockalingam Ramasamy
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Title:
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Method to deposit a copper seed layer for dual damascene interconnects
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| STREET 2 |
| 60 WOODLANDS INDUSTRIAL PARK D |
| SINGAPORE, 738406, SINGAPORE |
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| GEORGE O. SAILE |
| 20 MCINTOSH DRIVE |
| POUGHKEEPSIE, NY 12603 |
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