Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/22/2001
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Application #:
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09646050
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Filing Dt:
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09/13/2000
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Inventors:
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Seiji Kyuno, Toshiaki Masuda
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Title:
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Heat-expandable microcapsules and method of utilizing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-3, SHIBUKAWA-CHO 2-CHOME, YAO-SHI |
| OSAKA, 581-0075, JAPAN |
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| FOLEY & LARDNER |
| RICHARD L. SCHWAAB |
| WASHINGTON HARBOUR |
| 3000 K STREET, N.W., SUITE 500 |
| WASHINGTON, DC 20007-5109 |
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