Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09506708
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Filing Dt:
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02/18/2000
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Inventors:
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Myung Jin Yim, Kyung Wook Paik
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Title:
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Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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373-1, KOOSEONG-DONG, YOOSEONG-KU |
TEJEON-CITY, 305-701, KOREA, REPUBLIC OF |
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GREER, BURNS & CRAIN, LTD. |
PATRICK G. BURNS |
233 S. WACKER DRIVE |
SUITE 8660 - SEARS TOWER |
CHICAGO, IL 60606 |
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