Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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05/29/2001
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Application #:
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09238166
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Filing Dt:
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01/28/1999
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Inventors:
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TETSURO WASHIDA, MASATAKA WADA
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Title:
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PACKAGING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-CHOME, CHIYODA |
| TOKYO 100-831?, JAPAN |
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| OTEMACHI 2- CHOME, CHIYODA-KU |
| TOKYO 100-0004, JAPAN |
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| MCDERMOTT, WILL & EMERY |
| STEPHEN A. BECKER |
| 600 13TH STREET NW |
| WASHINGTON, DC 20065 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-20-1 JOSUIHON-CHO, KODAIRA |
| TOKYO, JAPAN 187-8588 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN 135-0061 |
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| TOMOKI TANIDA |
| MCDERMOTT WILL & EMERY LLP |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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Assignment:
4
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD |
| SUITE 210 |
| ALEXANDRIA, VA 22314 |
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