Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
2
|
Patent #:
|
|
Issue Dt:
|
05/29/2001
|
Application #:
|
09173345
|
Filing Dt:
|
10/15/1998
|
Inventors:
|
NOBORU SHINGAI, TATSUO WADA, KATSURO AOSHIMA
|
Title:
|
CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND BUMP-TYPE CONTACT HEAD AND SEMICONDUCTOR COMPONENT PACKAGING MODULE USING THE CIRCUIT BOARD
|
|
Assignment:
1
|
|
|
|
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
5668-1, FUKUDA, YAMATO-SHI |
KANAGAWA, JAPAN |
|
|
|
FRISHAUF, HOLTZ, GOODMAN & CHICK, P.C. |
LEONARD HOLTZ |
767 THIRD AVENUE, 25TH FLOOR |
NEW YORK, NY 10017-2023 |
|
|
Assignment:
2
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
14-15, OGAMI 5-CHOME, |
AYASE-SHI, KANAGAWA, JAPAN |
|
|
|
LEONARD HOLTZ |
220 FIFTH AVENUE |
16TH FLOOR |
NEW YORK, NY 10001-7708 |
|
|
Search Results as of:
05/14/2024 09:31 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|