Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/05/2001
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Application #:
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09565452
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Filing Dt:
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05/05/2000
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Inventors:
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Kun-A Kang, Kyujin Jung, Hyung Jun Park, Jun Hong Lee
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Title:
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Method for packaging a semiconductor chip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD RD., 811 NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C |
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| BIRCH, STEWART ET AL |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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