Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/05/2001
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Application #:
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09044928
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Filing Dt:
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03/20/1998
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Inventors:
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HIDEJI AOKI, HIDENORI SEKIYA, KENICHIROU KATOU, HIROMU NISHITANI
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Title:
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SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PRESS DIE AND GUIDE RAIL INCLUDING FORMING A CRACK PERPENDICULAR TO AN EXTENTSION OF THE SEALING RESIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-3, MARUNOUCHI 2-CHOME |
CHIYODA-KU, TOKYO 100, JAPAN |
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6-2, OTEMACHI 2-CHOME |
CHIYODA-KU, TOKYO 100, JAPAN |
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OBLON SPIVAK MCCLELLAND MAIER & NEUSTADT |
C. IRVIN MCCLELLAND |
FOURTH FLOOR |
1755 JEFFERSON DAVIS HIGHWAY |
ARLINGTON, VA 22202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, |
KANAGAWA, JAPAN 211-8668 |
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MCDERMOTT WILL & EMERY LLP |
600 THIRTEENTH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5-20-1 JOSUIHON-CHO, KODAIRA |
TOKYO, JAPAN 187-8588 |
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TOMOKI TANIDA |
MCDERMOTT WILL & EMERY LLP |
500 NORTH CAPITOL STREET, N.W. |
WASHINGTON, DC 20001 |
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