Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/05/2001
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Application #:
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09186067
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Filing Dt:
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11/05/1998
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Inventors:
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TETSUYA UEDA, EIJI TAMAOKA, NOBUO AOI
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Title:
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SEMICONDUCTOR DEVICE HAVING MULTILEVEL INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SAIWAI-CHO, TAKATSUKI-SHI |
| OSAKA 569-1193, JAPAN |
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| MCDERMOTT, WILL & EMERY |
| EDWARD E. KUBASIEWICZ, ESQ. |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1-3-7, SHIROMI, CHUO-KU |
| MATSUSHITA IMP BLD., 19TH FLOOR |
| OSAKA 540-6319, JAPAN |
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| MCDERMOTT, WILL & EMERY |
| JAMES E. EAKIN |
| 2700 SAND HILL ROAD |
| MENLO PARK, CA 94025 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE MARKET PLAZA, STEUART TOWER, SUITE 800 |
| SAN FRANCISCO, CALIFORNIA 94105 |
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| GREGORY M. HOWISON |
| P.O. BOX 741715 |
| DALLAS, TX 75374-1715 |
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