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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/05/2001
Application #:
09525322
Filing Dt:
03/13/2000
Inventors:
Tatsunori Kobayashi, Hiroshi Tanaka, Naoki Rikita
Title:
Wafer holding head and wafer polishing apparatus, and method for manufacturing wafers
Assignment: 1
Reel/Frame:
010967/0635Recorded: 07/17/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/20/2000
Exec Dt:
04/20/2000
Exec Dt:
04/20/2000
Assignee:
1-5-1, OHTEMACHI
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
OLBON, SPIVAK, MCCLELLAND, ET AL.
MARVIN J. SPIVAK
1755 JEFFERSON DAVIS HIGHWAY
ARLINGTON, VA 22202
Assignment: 2
Reel/Frame:
014743/0028Recorded: 06/17/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/14/2004
Assignee:
11-1, HANEDA ASAHI-CHO, OHTA-KU
TOKYO 144-8510, JAPAN
Correspondent:
OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST
1940 DUKE STREET
ALEXANDRIA, VA 22314
ATTN: MARVIN J. SPIVAK

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