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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6245595
Issue Dt:
06/12/2001
Application #:
09359074
Filing Dt:
07/22/1999
Inventors:
LUU NGUYEN, HEM.P TAKIAR, ETHAN WARNER, SHAHRAM MOSTAFAZADEH, JOSEPH O. SMITH
Title:
TECHNIQUES FOR WAFER LEVEL MOLDING OF UNDERFILL ENCAPSULANT
Assignment: 1
Reel/Frame:
010128/0117Recorded: 07/22/1999Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NGUYEN, LUU
Exec Dt:
07/07/1999
TAKIAR, HEM P.
Exec Dt:
07/14/1999
WARNER, ETHAN
Exec Dt:
07/07/1999
MOSTAFAZADEH, SHAHRAM
Exec Dt:
07/07/1999
SMITH, JOSEPH O.
Exec Dt:
07/07/1999
Assignee:
NATIONAL SEMICONDUCTOR CORPORATION
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CALIFORNIA
Correspondent:
BEYER & WEAVER, LLP
MICHAEL J. FERRAZANO
P.O. BOX 61059
PALO ALTO, CA 94306
Assignment: 2
Reel/Frame:
012447/0376Recorded: 01/10/2002Pages: 6
Conveyance:
CORRECTED RECORDATION FORM COVER SHEET TO CORRECT STATE OF INCORPORATION, PREVIOUSLY RECORDED AT REEL/FRAME 010128/0117 (ASSIGNMENT OF ASSIGNOR'S INTEREST)
Assignors:
NGUYEN, LUU
Exec Dt:
07/07/1999
TAKIAR, HEM P.
Exec Dt:
07/14/1999
WARNER, ETHAN
Exec Dt:
07/07/1999
MOSTAFAZADEH, SHAHRAM
Exec Dt:
07/07/1999
SMITH, JOSEPH O.
Exec Dt:
07/07/1999
Assignee:
NATIONAL SEMICONDUCTOR CORPORATION
2900 SEMICONDUCTOR DRIVE
SANTA CLARA, CALIFORNIA 95051
Correspondent:
BEYER WEAVER & THOMAS LLP
STEVE D. BEYER
PO BOX 778
BERKELEY, CA 94704-0778

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