Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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06/12/2001
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Application #:
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09219808
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Filing Dt:
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12/23/1998
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Inventors:
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JERROLD L. KING, JERRY M. BROOKS
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Title:
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REDUNDANCY MAPPING IN A MULTICHIP SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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8000 SOUTH FEDERAL WAY |
BOISE, IDAHO 83716 |
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SCHWEGMAN, LUNDBERG, WOESSNER ET AL. |
RUSSELL D. SLIFER |
P.O. BOX 2938 |
MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HWA-YA TECHNOLOGY PARK NO. 669, FUHSING 3 RD |
KUEISHAN, TAOYUAN, TAIWAN |
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DORSEY & WHITNEY LLP - IP DOCKET DEPT. |
701 FIFTH AVENUE |
SUITE 6100 |
SEATTLE, WA 98104-7043 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HWA-YA TECHNOLOGY PARK NO. 669, FUHSING 3 RD |
KUEISHAN, TAOYUAN, TAIWAN |
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DORSEY & WHITNEY LLP - IP DOCKET DEPT. |
701 FIFTH AVENUE |
SUITE 6100 |
SEATTLE, WA 98104-7043 |
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