Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/10/2001
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Application #:
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09642319
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Filing Dt:
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08/21/2000
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Inventors:
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Feng-Lung Chien, Randy H.Y. Lo, Chun-chi Ke
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Title:
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Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG ROAD TANTZU |
TAICHUNG, TAIWAN, TAIWAN R.O.C |
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN |
PETER F. CORLESS |
INTELLECTUAL PROPERTY PRACTICE GROUP |
130 WATER STREET |
BOSTON, MA 02109 |
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