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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/10/2001
Application #:
09642319
Filing Dt:
08/21/2000
Inventors:
Feng-Lung Chien, Randy H.Y. Lo, Chun-chi Ke
Title:
Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip
Assignment: 1
Reel/Frame:
011032/0972Recorded: 08/21/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/07/2000
Exec Dt:
08/07/2000
Exec Dt:
08/07/2000
Assignee:
NO. 123, SEC. 3, DA FONG ROAD TANTZU
TAICHUNG, TAIWAN, TAIWAN R.O.C
Correspondent:
DIKE, BRONSTEIN, ROBERTS & CUSHMAN
PETER F. CORLESS
INTELLECTUAL PROPERTY PRACTICE GROUP
130 WATER STREET
BOSTON, MA 02109

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